我(wo)公司授權代理Azimuth公司全系列產(chan)品，美(mei)國Azimuth電(dian)子集團公司致(zhi)力于(yu)為(wei)自動化、商業、醫(yi)療(liao)、電(dian)子和(he)(he)通信行業提(ti)(ti)供與之匹配的(de)(de)最先進的(de)(de)夾(jia)具(ju)制造方案。通過(guo)集成回路(lu)，無鉛芯片(pian)載(zai)體(ti)單(dan)元，多芯片(pian)單(dan)元，陣(zhen)列及芯片(pian)封(feng)裝技術為(wei)電(dian)子行業領域(yu)提(ti)(ti)供夾(jia)具(ju)管(guan)(guan)、晶(jing)體(ti)管(guan)(guan)和(he)(he)微型組件。早在上(shang)個世紀80年代初，Azimuth的(de)(de)高(gao)速集成電(dian)路(lu)就已由(you)達到0.020英(ying)寸標(biao)準的(de)(de)電(dian)流接觸器和(he)(he)載(zai)波系統及0.50毫米(mi)的(de)(de)鉛芯設計而成。現在在極大與極小的(de)(de)封(feng)裝內(nei)我(wo)們可以實現更高(gao)的(de)(de)I.O計數，更快的(de)(de)測(ce)試(shi)速度和(he)(he)更長的(de)(de)接觸壽(shou)命(ming)。
Dual Flatpack Package（DFP封裝(zhuang)(zhuang)）,Fiber Optic / Laser Diodes（用于半導體激(ji)光(guang)器的蝶形(xing)封裝(zhuang)(zhuang)）,Leaded Chip Carrier（LCC超(chao)大間隔(ge)芯(xin)片(pian)載(zai)體）,Land Grid Array /Ball Grid Array （LGA封裝(zhuang)(zhuang)）,Leadless Chip Carrier（LLCC無鉛芯(xin)片(pian)載(zai)體）,Multi Chip Module /High Density Interconnect（MCM多芯(xin)片(pian)組(zu)件(jian)及高密度連(lian)接）,Plug-in （Plug-in插件(jian)）,Power Hybrid Modules（Power Hybrid功率混合微(wei)膜組(zu)件(jian)）,Quad Flatpack Package（QFP封裝(zhuang)(zhuang)）,Small Outline Integrated Circuit（SOIC小型集成電路）,Stack Flatpack Package,LIF Socket for 16 pin TO devices,Socket for microwave packages with pads,Zero Insertion Force Socket for medical device with leads,Zero Insertion Force Socket for 225 PGA devices,Socket for substrate with pads,Socket for high frequency testing,Kelvin LIF Socket for TO devices,High Temperature Burn-in Socket with option Heat Sink,Socket for RF devices with pads,Socket for Micro-BGA devices,Test Socket for two-sided medical device with pads,Burn-in Socket for two-sided medical device with pads.Azimuth socket,Azimuth test socket.